(eng): An evaluation package with eight 8xSIMD, FP03x8, floating-point, run-time-reconfigurable accelerators for Zynq Ultrascale+ TE0808-09EG-ES1 module on TEBF0808 carrier board. The TE0808-09EG-ES1 module and TEBF0808 carrier board are designed and manufactured by the company Trenz Electronic. Xilinx device ZU09-EG-ES1 device requires in the design phase Xilinx Vivado tools version 2017.4. These tools must have enabled support for the Xilinx ZU09-EG-ES1 device. The Xilinx Vivado 2017.4 is currently the last Xilinx toolchain supporting the ZU09-EG-ES1 device. The evaluation package provides several pre-compiled HW designs represented in form of SD-cards containing the designs and API interface for SW developer in form of shared Debian Linux libraries. The SW developer can program ARM host application in standard gcc or g++ compiler and “make” can be used for compilation of host applications directly on the embedded Zynq Ultrascale+ ZU09-EG-ES1 based system.